IC Package Substrate, also known as IC Package Substrate, is the key carrier of integrated circuit industrial chain packaging and testing links. At present, IC Package Substrate is usually made of traditional multilayer or HDI board as the basis. Play in the chip and the printed circuit board between the heart to provide electrical connection (transition), at the same time to provide protection for the chip, support, heat dissipation channel, and meet the standard installation.
Any query pls contact us sales9@hitechpcb.com.
https://hitechcircuits.com/ic-package-substrate/
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