6 layer high density pcb for intercon with immersion gold finishing on top and bottom, HID pcb composed of FR-4 Tg150 halogen free. The thickness of finished board and the copper are 1.0mm and 12um. When higher density components are required, microvias are used instead of vias, and vias are used to improve wiring skill, thus, high density printed circuit board technology is the best choice.
Technical Parameters
6L High density PCB (HDI PCB) for intercom
Board dimensions: 80 x 120mm
Finished board thickness: 1.0mm
Material: FR-4 Tg150 halogen free
Minimum holes size: 0.1mm
Minimum line width/clearance: 2/3mil
Copper thickness: T oz (12um)
Solder mask: top and bottom (color: Blue)
Silkscreen: top (color: white)
Finish: immersion gold (top and bottom)
Board stack up: 1 + 4 + 1
